Sign In | Join Free | My enlightcorp.com
China Hangzhou Freqcontrol Electronic Technology Ltd. logo
Hangzhou Freqcontrol Electronic Technology Ltd.
Hangzhou Freqcontrol Electronic Technology Ltd. We Grow Crystal. We Fabricate Wafer. We are Piezoelectric Specialist.
Verified Supplier

4 Years

Home > Piezoelectric Wafer >

State - Of - The - Art Piezoelectric Wafer Fabrication For MEMS And SAW Devices Advanced Processing Capabilities For Results

Hangzhou Freqcontrol Electronic Technology Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

State - Of - The - Art Piezoelectric Wafer Fabrication For MEMS And SAW Devices Advanced Processing Capabilities For Results

Brand Name : CQTGROUP

Model Number : Chip Foundry Services

Certification : ISO:9001, ISO:14001

Place of Origin : China

MOQ : 1 pcs

Price : Negotiable

Payment Terms : T/T

Supply Ability : 10000 pcs/Month

Delivery Time : 1-4 weeks

Packaging Details : Cassette/ Jar package, vaccum sealed

Product : Chip Foundry Services

materials : LiNbO₃,LiTaO₃,Crystal Quartz,Glass,Sapphire etc.

service : Lithography,Etching,Coating, Bonding

Lithography : EBL Proximity Lithograph oStepper Lithography

Supporting Equipment : Grinding/Thinning/Polishing/ Machines etc.

Bonding : Anodic,Eutectic,Adhesive,Wire Bonding

Contact Now

State-of-the-Art Piezoelectric Wafer Fabrication for MEMS and SAW Devices Advanced Processing Capabilities for Results

We specialize in providing comprehensive chip foundry services, catering to clients who require high-quality wafer processing and fabrication. By simply providing design schematics and specifications, we deliver tailored solutions that meet your exact needs. Our extensive range of wafers includes Lithium Niobate (LiNbO), Lithium Tantalate (LiTaO), Single Crystal Quartz, Fused Silica Glass, Borosilicate Glass (BF33), Soda-Lime Glass, Silicon Wafers, and Sapphire, ensuring versatility for diverse applications.

Advanced Wafer Materials Portfolio‌
Our expertise spans industry-standard and exotic substrates:

  • Lithium Niobate (LiNbO₃, 4"-6" wafers)
  • Lithium Tantalate (LiTaO₃, Z-cut/Y-cut)
  • Single Crystal Quartz (AT-cut/SC-cut)
  • Fused Silica (Corning 7980 equivalent)
  • Borosilicate Glass (BF33/Schott Borofloat®)
  • Silicon (100/111 orientation, 200mm max)
  • Sapphire (C-plane/R-plane, 2"–8")

‌Core Fabrication Technologies‌

  1. ‌Lithography‌

    • Electron Beam Lithography (EBL, 10nm resolution)
    • Stepper Lithography (i-line, 365nm)
    • Proximity Mask Aligner (5μm alignment accuracy)
  2. ‌Etching‌

    • ICP-RIE (SiO₂/Si etch rate 500nm/min)
    • DRIE (Aspect ratio 30:1, Bosch process)
    • Ion Beam Etching (Angular uniformity <±2°)
  3. ‌Thin-Film Deposition‌

    • ALD (Al₂O₃/HfO₂, <1nm uniformity)
    • PECVD (SiNₓ/SiO₂, stress-controlled)
    • Magnetron Sputtering (Au/Pt/Ti, 5nm–1μm)
  4. ‌Wafer Bonding‌

    • Anodic Bonding (Glass-to-Si, 400°C/1kV)
    • Eutectic Bonding (Au-Si, 363°C)
    • Adhesive Bonding (BCB/SU-8, <5μm warpage)

‌Supporting Process Infrastructure‌

  • Precision Grinding (TTV <2μm)
  • CMP Polishing (Ra <0.5nm)
  • Laser Dicing (50μm kerf width)
  • 3D Metrology (White-light interferometry)

Product Tags:

Advanced Processing Capabilities Piezoelectric Wafer

      

MEMS Piezoelectric Wafer

      

SAW Devices Piezoelectric Wafer

      
Quality State - Of - The - Art Piezoelectric Wafer Fabrication For MEMS And SAW Devices Advanced Processing Capabilities For Results for sale

State - Of - The - Art Piezoelectric Wafer Fabrication For MEMS And SAW Devices Advanced Processing Capabilities For Results Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Hangzhou Freqcontrol Electronic Technology Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)